Microelectronics and Advanced Packaging Technologies Roadmap 2.0
The Semiconductor Research Corporation has released its Microelectronics and Advanced Packaging Technologies (MAPT) Roadmap 2.0, a comprehensive update to the industry’s first 3D semiconductor roadmap.
The roadmap includes contributions from over 370 experts from 132 organizations and features updated content, including a new chapter on digital twins and their applications.
The roadmap was funded by the U.S. Department of Commerce’s NIST and supports the CHIPS Act by providing a strategic framework for the semiconductor supply chain.
No specific quotes available in the given text.
Author's summary: Roadmap for microelectronics technology updated.
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